IPC Cal Flex, Inc.
What's New
Looking toward the Future
IPC Cal Flex, Inc. stays on the cutting edge of the printed circuit boards manufacturing with its use of flexible substrates and advanced microvia and rigidflex technology.
These technologies are used in a variety of electronics packaging applications, including chip scale packages, wafer scale packages, wire bond and flip chip applications.
A few of the advantages of the latest microvia, high density interconnect flex products include:
- Lower board cost through size and layer reduction.
- Increased wiring density.
- Improved reliability of low aspect ratio microvia vs. plated through holes.
- Improved electrical performance due to drastically reduced inductance and capacitance of plated through holes.
- Lower RFI and/or EMI.
- Improved thermal efficiency and high temperature stability through ultra thin dielectric and high glass transition temperature.