Design Guidelines and Materials

Base Materials

Polyimide 1/2 mil to 5 mil
Adhesiveless Materials 1/2 mil to 3 mil polyimide, 1/3 oz. to 2 oz. copper
Flame retardant laminates and coverlay

Base Copper

1/3 oz - .00047" thick copper
1/2 oz - .0007" thick copper
1 oz - .0014" thick copper
2 oz - .0028" thick copper
Copper thickness to 0.010"

Other Dielectric:

Inconel
Invar
Constantan

Solder Mask

Polyimide coverlay: 1/2 mil to 5 mils
Soldermask (LPI), various colors
Photoimageable Coverlay (PIC)

Surface Finish

Hot Air Solder Level (HAL) (regular & lead free)
Tin Plating - Electroless and Electrolytic (RoHS Compliant)
Hard & Soft Gold over Nickel (RoHS Compliant)
ENIG (Electroless Nickel Immersion Gold) (RoHS Compliant)
Nickel (RoHS Compliant)
Silver Immersion (RoHS Compliant)
OSP Organic Solderabilty Preservative (RoHS Compliant)

Rigidizers/Stiffeners

Polyimide
G10/FR4
Metal: Aluminum, Stainless Steel

Shielding Layers

Copper
Silver Epoxy
Conductive Silver Film

Value Added Assembly

Thru hole assembly
Surface mount components down to 0201
SMT components including discrete, SOIC's,
PLCC's, QPPs & BGA's
Fine pitch capability to .4mm pitch
Leaded devices
Tactile domes
Staked Terminals
RoHS Compliant Assembly